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Nichia LED NCSU434A UVC 17mW 280nm 0.5W Japan Original

High performance UV-C NCSU434A SMD LED with 280nm and 17.5mW typical radiant power
Typical voltage 5.3V, current 100mA
Typical power consumption: 0.5W
120 deg viewing angle
Dimensions (LxWxH): 3.5×3.5×1.72mm

Application areas： Disinfection， Sterilization

Weight (g) 1.000000
LED Installation Package Emitter
Color UVC Ultraviolet
Viewing Angle 120°
Forward Current Typ 350ma
Forward Voltage Typ (V) 5.3
Power (W) 0.5
Wavelength (nm) 280
Manufacturer Product Code NCSU434A UV-C

3D UV LED printer curing light source module NVSU035B 395nm UV

Specification

Wavelength: 395nm
Voltage: 3.8-4V
Current: 700mA (single chip)
Power: 45W
Module size: 7553mm Luminous surface size: 5340mm

NCSU034B Nichia UV LED 385nm 540 mW

Mounting Type
Emitting Color 385 nm
Chip Material
Luminous Intensity 540 mW
Viewing Angle 120
Lens Type-Color
Forward Voltage 3.7 V
Forward Current 500 mA
Maximum Forward Voltage 4.3 V
Maximum Forward Current 1000 mA
Min-Max Operating Temperature -10C to +85C
Factory Pack 500 PCS/Reel

This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.

• Reflow soldering must not be performed more than twice.
• Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
• Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
  caused by heat and/or atmosphere.
• Repairing should not be done after the LEDs have been soldered.
  It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• The Die Heat Sink should be soldered to customer PCB.
  If it is difficult or impossible, use high heat-dissipating adhesive.
• When soldering, do not apply stress to the LED while the LED is hot.
• When using a pick and place machine, choose an appropriate nozzle for this product.
• The recommended soldering pad pattern is designed for attachment of the LED without problems.
  When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
  are suitable for the circuit design.
• When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
  where the flux will come in contact with the LEDs.
• Make sure that there are no issues with the type and amount of solder that is being used.